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“As pioneers in wireless technologies, Qualcomm Technologies is pleased to further strengthen our longstanding relationship with HARMAN to help bring the Ready Connect 5G TCU to the industry. This product exemplifies our dedication to driving connectivity innovation in the automotive industry, delivering a seamless combination of performance, reliability, and cutting-edge features through the utilization of our Snapdragon Modem-RF Gen 2 system,” said Jeff Arnold, Vice President, Product Management, Qualcomm Technologies, Inc.

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Shri Joshi, vice president of Green Industrial Power, Infineon Technologies Americas said,” The joint 30kW DC fast charger reference platform, which includes Infineon’s latest power modules and devices, will help our customers bring more fast chargers to market as the future moves to electrical vehicles. We look forward to this ongoing collaboration to support our customer base.”

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K N Prasad, Managing Director, Toyota Kirloskar Auto Parts, said “Given the renewed capability of Indian auto industry and the strong continued Government support through schemes such as PLI, we have made visible progress in establishing India as a critical manufacturing hub of advance, clean and efficient vehicles aimed at attending competitive pricing in the future,”

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M C Sudhakar, Hon’ble Higher Education Minister, Government of Karnataka said, “We are delighted to be a part of the MoU signing between Toyota Kirloskar Motor and the Department of Technical Education, Government of Karnataka, marking a significant milestone in the realm of education and skill development in the State.

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