Browsing: Simulation & Testing

Gilles Bonkoski, Chief Business Officer of Powersys, emphasized the company’s commitment to providing next-generation solutions for fully optimized electrical and electromagnetic systems design. “Our global team of experts collaborates closely to deliver cutting-edge technology and engineering expertise to our clients worldwide.”

Prof. V. Kamakoti, Director, IIT Madras, said, “Given the Government’s focus on eMobility and rapid expansion of the market that is expected, there is a need for IIT Madras to play its role in the academic space.”

“With its simulation-based risk profiles, SIMULYTIC is a catalyst for the deployment of autonomous vehicles at scale”, said Leen Balcaen, Vice President Product Management SD and HD Maps at HERE Technologies.

Valeo, a global leader in automotive technology, and Applied Intuition, a vehicle software supplier, are partnering to provide a digital twin…

Cognata LTD has announced it will demonstrate its hardware automated parking assistance (APA) technology concept and architecture at CES 2024.

Lidwave, a developer of high-performance LiDAR-on-a-chip sensors, has announced that its MonoStaticOne sensor is available for simulation of industrial and automotive use cases, on the Cognata’s perception hub, running on Microsoft Azure and utilizes AMD processors and GPUs.

Hyundai Mobis is establishing a system capable of developing and validating key vehicle technologies in an unrestricted digital virtual environment.

Cognata proudly announces its collaboration with Microsoft to drive the Automated Driving Perception Hub (ADPH) global program, running on Microsoft Azure, and AMD EPYC™ processors and Radeon™ GPUs, to allow Automotive customers to virtually and efficiently evaluate ADAS/AV sensors through digital twin-based sensor simulation.

SimScale GmbH announced new features for engineers focused on structural and mechanical simulation, including large-scale vibration analysis and modal-based harmonics.

Ansys has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems manufactured with TSMC’s 3DFabric™ advanced packaging technologies.