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CATL and Stellantis N.V. has announced the signing of a non-binding MoU for the local supply of LFP battery cells and modules to power Stellantis’ electric vehicle production in Europe. The two companies are considering the possibility to form a joint venture with equivalent contributions.
Komatsu has agreed to acquire American Battery Solutions. Komatsu is planning to close the acquisition on 1 December 2023, on the condition that all necessary procedures for the closing are completed.
Honda Motor Co. has announced the introduction of the new Honda SENSING 360+ omnidirectional safety and driver-assistive system which removes blind spots around the vehicle and contributes to collision avoidance and the reduction of driver burden while driving.
Leveraging Sibros’ Deep Connected Platform, this partnership aims to deliver a robust, integrated vehicle-to-cloud ecosystem for CUBONIC’s bespoke vehicles. The technology will enable live data collection, over-the-air software updates, and real-time remote diagnostics, enhancing operational efficiency, safety, and the user experience.
Advanced Electric Machines (AEM) has announced it has secured £23 million of new investment. The funding will be used to scale up production capacity at its facility in the North East, deliver on ambitious growth plans to establish a global sales footprint, and bolster R&D capabilities.
Bosch eBike Systems is expanding its theft protection for eBikes featuring the smart system with the latest update to the eBike Flow app. The new eBike pass and theft report functions help protect eBikes from theft by making it easier to identify and quicker to report to the police by simple data transfer.
Vitesco Technologies has opened a new, 2,800 m2 manufacturing space at its Icheon electronics site. The components for Vitesco Technologies’ EMR4 (Electronics Motor Reducer) electric axle drive will be produced by series manufacturing equipment.
VicOne and Block Harbor have developed an integrated workflow-based system for the automotive industry that provides actionable intelligence to cybersecurity design teams, the Vehicle Security Operations Center (VSOC) and Product Security Incident Response Teams.
Commerce and Industry Minister Piyush Goyal recently engaged in discussions with Micron Technology CEO and President Sanjay Mehrotra during his visit to the US for the Indo-Pacific Economic Framework (IPEF) meeting in San Francisco.
Ansys has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems manufactured with TSMC’s 3DFabric™ advanced packaging technologies.